When should inspection of soldering and cleanliness be performed?

Inspection of soldering and cleanliness should be performed prior to conformal coating, staking, or encapsulation because this phase is critical for ensuring that the underlying solder joints and the surface cleanliness are up to specifications before any protective coating is applied. Conformal coatings, stakes, or encapsulations can trap contaminants or defects if the inspection is not conducted beforehand, which may lead to future reliability issues or failures in the assembly.

By ensuring that solder connections are properly made and that the surface is free of contaminants before these processes are applied, manufacturers can enhance the longevity and functionality of the electronic assemblies. The timing of this inspection is crucial, as inspecting afterward could prevent potential issues from being identified early enough to take corrective action, thus compromising the integrity of the assembly.

This reinforces the understanding that early detection through inspection is essential to maintain quality standards in electronic manufacturing and assembly.