What standard should solder paste be compliant with?

Solder paste should be compliant with J-STD-005. This standard specifically addresses requirements for solder paste, including its composition, manufacturing, and performance characteristics. J-STD-005 outlines criteria for evaluation, including viscosity, transfer efficiency, and overall printing performance. Ensuring compliance with this standard is crucial for guaranteeing the reliability and quality of soldering processes in electronic assemblies, as it directly affects the performance of the soldering operation and the integrity of the final product.

In contrast, the other standards focus on different aspects of soldering materials and processes. For instance, J-STD-003 pertains to the quality of soldering materials, but not specifically solder paste. J-STD-004 addresses the requirements for flux and its classification. J-STD-009 deals with the requirements for rework, repair, and modification of soldered assemblies. Therefore, the focus of J-STD-005 on solder paste makes it the appropriate standard for compliance in this context.