What should be removed from all solder cup terminals to meet the requirements?

To meet the requirements outlined in J-STD-001 for soldered electrical and electronic assemblies, gold must be removed from all solder cup terminals. This is primarily due to the risk of embrittlement and the potential difficulty in achieving reliable solder joints when gold is present. Soldering directly to gold surfaces can lead to poor adhesion and the formation of intermetallic compounds that may compromise the integrity of the connection.

Tin, copper, and silver do not pose the same risks as gold in soldering applications. Tin is commonly used in solder, copper is often found in terminals and conductors, and silver may be used in various solder alloys. However, when gold is not adequately removed or barriers are not put in place, the soldering process can be adversely affected, making it essential to adhere to the standards set forth in J-STD-001.