What protective measures must be taken regarding heat-sensitive components?

Minimizing exposure to high temperatures is essential for protecting heat-sensitive components because these components can suffer damage at elevated temperatures. Heat can lead to physical changes in certain materials, such as melting or warping, and can also affect the electrical properties, potentially causing failures over time. Integrated circuits, semiconductor devices, and certain types of sensors can be particularly vulnerable to thermal stress and may malfunction or degrade if subjected to temperatures outside their specified limits.

While increasing airflow, insulating with thermal blankets, or using cooling baths can be useful strategies for managing heat in some contexts, the primary preventive measure for heat-sensitive components is to limit their exposure to high temperatures effectively. This approach is inherent in the design and handling practices outlined in IPC standards, ensuring that such components maintain their integrity and functionality throughout the manufacturing and operational processes.