What must be limited regarding solder bath exposure periods during PCB assembly?

Limiting the duration of solder bath exposure is crucial during PCB assembly to prevent damage to the components and the printed circuit board itself. Prolonged exposure to the high temperatures of a solder bath can lead to thermal stress, which can negatively impact the integrity of sensitive electronic components.

Excessive exposure can cause solder joints to become brittle, increase the risk of solder voids, and potentially lead to component failure. By regulating the exposure time, manufacturers can ensure that components are adequately soldered without compromising their reliability or performance.

While temperature, type of flux, and amount of solder are all important factors in the soldering process, the specific focus on exposure duration addresses the immediate risk associated with thermal damage during soldering. Therefore, controlling the exposure time is a critical aspect of achieving high-quality solder joints and maintaining the reliability of electronic assemblies.