What method can help prevent oxidation of metal surfaces during soldering?

Controlling environmental humidity is a key method for preventing oxidation of metal surfaces during soldering. When humidity levels are managed appropriately, they can help reduce the formation of oxidation on metal surfaces, which is crucial for achieving good solder joints. Oxidation can create barriers that inhibit the bonding process between the solder and the metal conductor, leading to weak solder connections and potential failures in the electronic assembly.

In soldering environments, excessive humidity can lead to moisture accumulation, which can contribute to other issues such as corrosion or the formation of solder defects. However, controlling humidity to an optimal level ensures that too much moisture does not lead to complications while still minimizing oxidation.

By maintaining an appropriate humidity level, manufacturers and technicians can create ideal conditions for soldering, allowing for stronger and more reliable electrical connections.