What is the acceptable condition for leads prior to soldering?

The acceptable condition for leads prior to soldering focuses on ensuring that they are in good mechanical shape to facilitate a reliable solder joint. When leads do not exceed 10% deformation, it indicates that they are sufficiently intact and capable of fitting properly into the PCB holes. This condition is crucial because excessive deformation can impact the quality of the solder joint, potentially leading to failures such as cold solder joints or inadequate electrical connections.

While lead cleanliness and preparation are important, the specific requirement about deformation emphasizes the mechanical integrity of the leads. This ensures that they will not only fit correctly but also create a robust bond when soldered, contributing to the overall reliability of the electronic assembly.

Other options, while they address different aspects of lead preparation, do not capture the fundamental mechanical requirement that ensures proper soldering integrity. For example, leads should be clean, but they do not always need to have a shiny appearance (which might suggest they have been improperly prepared), nor do they need to be pre-coated with solder, as this can lead to issues with solderability and unnecessary complications in the soldering process.