What is required of assemblies after soldering operations?

After soldering operations, assemblies must be sufficiently cooled. This requirement is crucial because cooling allows the solder joints to solidify properly, ensuring mechanical stability and electrical reliability. Rapid cooling or thermal shock could lead to defects such as cracking or insufficient joint strength, which could compromise the integrity of the assembly.

Allowing the soldered joints to cool naturally ensures that the thermal stresses are managed appropriately, contributing to the overall quality and performance of the electronic assembly.

While testing after soldering is important to verify the functionality of the assembly, it does not replace the necessity for cooling. Storing in a warm environment or cleaning with solvents may be part of the assembly process but are not specifically required immediately after soldering. Each of these steps has its own importance, but adequate cooling is essential to prepare the assembly for subsequent processing or testing.