What is a common defect associated with improper solder application?

A cold solder joint is a common defect associated with improper solder application because it occurs when the solder does not flow adequately to form a strong electrical and mechanical connection. This typically results from insufficient heat being applied during the soldering process or from moving the joint while the solder is cooling, preventing the solder from fully melting and adhering to the component and substrate.

Cold solder joints can appear dull and grainy, lacking the smooth, shiny finish associated with properly applied solder. They can also lead to high resistance in the circuit and may result in intermittent connections or complete failures in electronic devices. It’s crucial to ensure that both the component and the PCB are adequately heated and that the solder is allowed to flow and solidify properly to avoid this defect.

Other choices, while they involve solder joints, do not represent the specific issue caused by improper application as clearly as a cold solder joint does. For instance, a raised solder joint may be due to excess solder rather than improper application, while excessively smooth joints and shiny solder surfaces indicate proper application and technique rather than defects.